METHOD OF SEALING PRINTED CIRCUIT BOARD USING CROSS-LINKED POLYMER BASED ON COMPOUND Russian patent published in 2024 - IPC H05K3/28 H01L23/29 C09K3/10 C08K3/36 C08L83/04 C08L63/00 

FIELD: electricity.

SUBSTANCE: invention relates to sealing of electrical products using polymer compositions. Disclosed is a method of sealing a printed circuit board, which includes installing a printed circuit board with soldered wires in a matching shape and size housing, one side of which is open, mixing components of the organosilicon compound, for this purpose, the base is poured into a container, mixed; with constant stirring of the base, quartz sand and a catalyst are added and the obtained mixture is mixed until a homogeneous mass, wherein the components of the organosilicon compound are taken at a ratio of base : quartz sand : catalyst of 25-30:20-25:1 wt.pts., wherein the quartz sand fraction is more than 0.6 mm, and the finished mixture of the organosilicon compound is distributed over the housing with the board, polymerisation of the organosilicon compound is carried out, the sealed printed circuit board is separated from the housing, and the board is operable before pouring and after polymerisation.

EFFECT: high thermal conductivity of the compound and high resistance of the compound to radio-frequency interference (RFI).

7 cl, 1 tbl, 15 ex