FIELD: chemistry.
SUBSTANCE: invention relates to filling pastes for sealing electrical products. Disclosed is an electrotechnical organosilicon compound containing 25-30 wt.pts. base in the form of Pentelast-727 silicone compound, or silicone, or epoxy, or polyurethane, or polyester resin, wherein apparent viscosity of base at 20 °C is not more than 20,000 cP, 1 wt.pts. catalyst in the form of Penta-680 catalyst, or a platinum compound, or an organic peroxide, or an organic acid, or an amine, or an amine complex, or boron fluorides and 20-25 wt.pts. quartz sand with particle size of more than 0.6 mm.
EFFECT: high heat conductivity of the compound and high resistance of the compound to radio-frequency interference.
4 cl, 7 tbl, 1 ex
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