SUSPENSION FOR 3D PRINTING OF MULTILAYER PRINTED CIRCUIT BOARDS USING LTCC- AND HTCC-COMPOSITIONS ACCORDING TO DLP TECHNOLOGY Russian patent published in 2024 - IPC C08L21/00 B33Y10/00 

Abstract RU 2821459 C1

FIELD: chemistry.

SUBSTANCE: invention relates to production of materials for 3D printing, namely to polymer-ceramic suspension for production of multilayer printed circuit boards based on co-firing ceramics using DLP technology. Polymer-ceramic suspension is characterized by the fact that it contains LTCC- or HTCC-composition as the main component.

EFFECT: invention enables to obtain suspension for 3D printing by DLP technology of multilayer printed circuit boards made from low-temperature (LTCC) or high-temperature (HTCC) ceramics of co-firing, which enables to print ceramic substrates while preserving properties of ceramics, such as high insulation resistance, dielectric strength, high reliability, ability to withstand loads in the microwave range with low dielectric losses.

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RU 2 821 459 C1

Authors

Iushin Denis Igorevich

Netreba Anastasiia Iurevna

Dates

2024-06-24Published

2023-12-29Filed