FIELD: electricity.
SUBSTANCE: multilayer multifunction GIS board consists of the thin-film board based on LTCC ceramic, on which the thin-film conductive layers are applied, the thin-film conductive layers are placed on both external surfaces of the thin-film LTCC boards, on the surface of which the layer and the multilayer thin-film commutation are deposited, the multilayer thin-film commutation and resistive layer are deposited, the multilayer thin-film commutation is made of consequently deposited layers of vanadium-copper-vanadium, the resistive layers are made of tantalum deposited layers. It is proposed the manufacturing method of the multilayer multifunction GIS board, including the manufacture of the multilayer thick-film LTCC board with the conductive topological pattern, deposited on both outer surfaces, and obtained by chemical etching, the levelling organic dielectric layers are applied on both external surfaces of the multi-layer thick-film LTCC board with embedded elements by centrifugation method, on which the thin-film conductive resistive and insulating dielectric layers are successively applied by the vacuum deposition.
EFFECT: integration degree increase, reduction of the final cost of the device and manufacturability of the multi-layer multifunction GIS board improvement.
6 cl, 1 dwg
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Authors
Dates
2017-08-31—Published
2016-02-24—Filed