FIELD: electric elements.
SUBSTANCE: invention relates to production of electronics (radio electronics), in particular to production of printed circuit boards at the stage of photolithography, and can be used in instrument-making, radio engineering and electronic industries. Installation of direct exposure of printed circuit boards includes systems of exposure, fixation, alignment and controller. Exposure system includes an ultraviolet light-emitting diode matrix (UV matrix), a diffuser providing parallelism of UV rays, located parallel to the UV matrix on the side of radiation propagation; monochrome liquid crystal matrix (LC matrix) located parallel to the UV matrix behind the diffuser, as well as subsystems for controlling the LC matrix and UV matrix. Fixation system includes a fixture made in the form of a frame with a transparent elastic film fixed along its perimeter, which is in tension, intended for fixation of the printed-circuit board workpiece on the LC matrix, and a vacuum pump with a control subsystem, which creates a rarefaction between the LC matrix and the fixture. Alignment system includes a video camera, the lens of which is directed towards the LC matrix and is perpendicular to its plane, and a camera movement subsystem. Controller receives information from the video camera and is connected to the video camera movement mechanism, as well as to the LC matrix, UV matrix and pump control subsystems.
EFFECT: simple design of the direct exposure device, high stability of the exposure operation.
1 cl, 3 dwg
