RESISTIVE ELEMENT MADE ON CERAMIC SUBSTRATE USING THICK-FILM TECHNOLOGY Russian patent published in 2025 - IPC H01C17/02 H01C17/65 

FIELD: electric elements.

SUBSTANCE: invention relates to electronic engineering and can be used in the creation of resistors, in the manufacture of a resistive element using a thick-film technology, in particular, for protection of resistive element against strain effect during attachment in housing by means of compounds based on epoxy resins. For this purpose, on a resistive element made on a ceramic substrate using a thick-film technology and fixed in a housing using an epoxy resin, after applying and firing the resistive paste, installation of leads on the non-working side of the ceramic substrate is applied an insulating layer of organosilicon glue with subsequent drying, after which the product is installed in the housing and fixed with epoxy resin, wherein the organosilicon layer creates a damper between the ceramic substrate and the epoxy resin.

EFFECT: providing the possibility of achieving the minimum TCR value of the resistor, eliminating the strain effect of materials with different thermal coefficients of linear expansion.

1 cl, 2 dwg, 2 tbl