FIELD: semiconductor devices. SUBSTANCE: process of manufacture of SHF bipolar transistors includes formation of collector and emitter junctions and high-doped regions of passive base on semiconductor substrate by way of selective diffusion of base additive into substrate. Diffusion of additive is conducted in temperature interval between 900-950 C in the course of 7-20 min to diminish capacitance of collector p-n junction and efficiency of collector circuit by decrease of horizontal dimensions of regions of passive base. EFFECT: diminished capacitance of collector p-n junction and efficiency of collector circuit.
Title | Year | Author | Number |
---|---|---|---|
BIPOLAR TRANSISTOR | 1981 |
|
SU1005607A1 |
TRANSISTOR | 1995 |
|
RU2119696C1 |
TRANSISTOR | 1995 |
|
RU2143157C1 |
COMPLEMENTARY BIPOLAR TRANSISTOR STRUCTURE OF INTEGRATED CIRCUIT | 1997 |
|
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PROCESS OF MANUFACTURE OF BICOS/BIMOS DEVICE | 1998 |
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RU2141148C1 |
BIPOLAR PLANAR N-P-N TRANSISTOR MANUFACTURING PROCESS | 1996 |
|
RU2107972C1 |
HEAVILY-DOPED TRANSISTOR | 0 |
|
SU1787296A3 |
BIPOLAR CMOS STRUCTURE MANUFACTURING PROCESS | 1995 |
|
RU2106039C1 |
BIPOLAR TRANSISTOR BASED ON HETEROEPITAXIAL STRUCTURES AND METHOD OF ITS REALISATION | 2012 |
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RU2507633C1 |
METHOD OF MANUFACTURE OF MONOLITHIC INTEGRATED CIRCUITS | 0 |
|
SU1808147A3 |
Authors
Dates
1997-01-10—Published
1981-12-09—Filed