FIELD: semiconductor devices. SUBSTANCE: process of manufacture of SHF bipolar transistors includes formation of collector and emitter junctions and high-doped regions of passive base on semiconductor substrate by way of selective diffusion of base additive into substrate. Diffusion of additive is conducted in temperature interval between 900-950 C in the course of 7-20 min to diminish capacitance of collector p-n junction and efficiency of collector circuit by decrease of horizontal dimensions of regions of passive base. EFFECT: diminished capacitance of collector p-n junction and efficiency of collector circuit.
| Title | Year | Author | Number |
|---|---|---|---|
| BIPOLAR TRANSISTOR | 1981 |
|
SU1005607A1 |
| TRANSISTOR | 1995 |
|
RU2119696C1 |
| TRANSISTOR | 1995 |
|
RU2143157C1 |
| COMPLEMENTARY BIPOLAR TRANSISTOR STRUCTURE OF INTEGRATED CIRCUIT | 1997 |
|
RU2111578C1 |
| PROCESS OF MANUFACTURE OF BICOS/BIMOS DEVICE | 1998 |
|
RU2141148C1 |
| BIPOLAR PLANAR N-P-N TRANSISTOR MANUFACTURING PROCESS | 1996 |
|
RU2107972C1 |
| HEAVILY-DOPED TRANSISTOR | 0 |
|
SU1787296A3 |
| BIPOLAR CMOS STRUCTURE MANUFACTURING PROCESS | 1995 |
|
RU2106039C1 |
| BIPOLAR TRANSISTOR BASED ON HETEROEPITAXIAL STRUCTURES AND METHOD OF ITS REALISATION | 2012 |
|
RU2507633C1 |
| METHOD OF MANUFACTURE OF MONOLITHIC INTEGRATED CIRCUITS | 0 |
|
SU1808147A3 |
Authors
Dates
1997-01-10—Published
1981-12-09—Filed