METHOD FOR MANUFACTURING PRINTED-CIRCUIT BOARDS ON ALUMINIUM SUBSTRATES Russian patent published in 1994 - IPC

FIELD: manufacture of radio electronic equipment. SUBSTANCE: in order to provide for planar surface of substrate, first double-sided anodizing of substrate is made through depth "a" of 0.25 the conductor thickness within substrate, oxide film is removed, and substrate is anodized again through depth h = a/K - 1, where K is volumetric coefficient of oxide growth in aluminium anodizing. Method enables regulation of conductor thickness inside substrate while retaining its planar surface within comprehensive range and formation of three levels of metallization. EFFECT: improved quality of multilayer printed-circuit boards on aluminium substrates due to regulation of anode oxide growth when shaping conductors on surface and inside substrate enabling decrease in surface profile. 7 dwg