PASTE FOR SOLDERING COPPER AND ITS ALLOYS Russian patent published in 1997 - IPC

Abstract SU 1718496 A1

FIELD: mechanical engineering; different branches of industry. SUBSTANCE: soldering paste contains the following components, mass %: copper phosphide solder 60-69; potassium permanganate 1-30; binder 0.5-1.5; the rest - solvent (butyl acetate). EFFECT: reduced labour input, improved quality of soldered joints owing to removing of oxide films from connected surfaces and solder. 3 tbl

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SU 1 718 496 A1

Authors

Chulkov E.I.

Pekin Ju.I.

Bajcher L.I.

Chelyshev V.B.

Khurin I.M.

Ryndin V.S.

Dates

1997-08-20—Published

1989-12-28—Filed