METHOD OF MANUFACTURE OF WIRING THIN-FILM HYBRID INTEGRATED CIRCUITS Russian patent published in 1995 - IPC

FIELD: manufacture of hybrid commutation boards. SUBSTANCE: plate of medium with film of polyimide varnish deposited in advance and copper target are placed into vacuum chamber. Under action of pulse laser radiation copper evaporates and precipitates on polyimide. After this galvanic build-up of copper is carried out and wiring is formed with the use of photolythography. Novelty of method lies in deposition of first layer of copper by pulse laser radiation with density of energy flux on surface of target 10⁹- 10¹⁰ W/cm² W/sq.cm at room temperature. Thanks to this optimum ratio of maximum adhesion of copper to polyimide and minimal change of dimensions of polyimide film for wiring are obtained. EFFECT: facilitated manufacture of thin-film hybrid integrated circuits. 1 dwg