FIELD: chemistry.
SUBSTANCE: invention relates to formation of gold contact pads on YBa2Cu3O7-x films on dielectric substrates. In the method of forming gold contact pads on YBa2Cu3O7-x films on a dielectric substrate, contact pads are formed before sputtering YBa2Cu3O7-x films on the dielectric substrate by heating a target and a substrate to 450-500°C, spraying the gold contact pad by laser sputtering a target made of gold with a solid-state pulsed laser with radiation wavelength of 1.06 mcm, pulse duration of 10-20 ns, pulse repetition frequency of 10 Hz and laser radiation power density of (5-7)·108 W/cm2. The dielectric substrate is placed 4-6 mm from the gold target with the working surface facing the target, at vacuum chamber pressure of 0.1-0.5 Pa.
EFFECT: obtaining high-quality gold contact pads on superconducting films.
2 dwg
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Authors
Dates
2015-01-10—Published
2013-05-06—Filed