FIELD: microelectronics. SUBSTANCE: method involves evaporation of material, generation of deposited material which is directed to substrate and depositing said material on substrate. Deposited coating is treated by pulse electromagnetic field either directly or by means of intermediate medium which has high electric conductivity. Another claim of invention describes method in which deposited coating is treated by pulse electromagnetic field with amplitude of 20-28 K-oersted and duration of 120-130 mcs. EFFECT: increased adhesion.
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