SEALED PACKAGE FOR MICROWAVE INTEGRATED CIRCUITS Russian patent published in 1994 - IPC

FIELD: microwave instrumentation engineering. SUBSTANCE: package has metal base, metal cover with flanged edges whose rectangular through cuts receive microwave terminal leads in the form of microstrip transmission line on rectangular dielectric substrate. Substrate surface abutting metal base and two end surfaces parallel to microstrip transmission line are metallized. Microstrip transmission line is cross-shaped as it forms metallized rectangular expanded sections abutting both microstrip transmission line and two metallized end surfaces of substrate. Metallized end surfaces are spaced apart at distance equal to dielectric substrate width and is selected within ; length of rectangular expanded section along microstrip transmission line is found from equation , where λ₀ is mean wavelength of working frequency range in free space; ε_g is dielectric constant of substrate material. Metallized portions of rectangular expanded sections of microstrip transmission line are in electric contact with horizontal strip of rectangular through cuts in flanged edges of cover over entire length between metallized end surfaces of dielectric substrate. EFFECT: simplified design, reduced electromagnetic loss level. 2 cl, 3 dwg