METHOD OF CONNECTING CERAMIC MATERIALS Russian patent published in 1994 - IPC

FIELD: electrical technology. SUBSTANCE: connective interlayer is applied on the surface of ceramics. Then ceramics is brought into contact with semi-conductor and is displaced on plate electrode. The process is followed by heating to temperature not more 800 C, by applying voltage till corona discharge is struck and by sustaining within at least 30 min. Connective interlayer has glass layer containing oxides of rare-earth, alkali- and alkali-earth metal, boron, phosphorous or layer of gold, aluminium, zinc, tin, gallium and lead. EFFECT: improves hermetic nature of connection at normal temperatures, decreases mechanical stress of connection, simplifies technology.