FIELD: electrical engineering.
SUBSTANCE: group of inventions relates to the technology of solid-state electronics and can be used in developing photodetectors of the visible and near infrared range. Photosensitive device has an electrode and a photosensitive layer structure formed on it, having a silicon substrate with p-type conductivity, having a surface with crystallographic orientation (111), with a layer of silicon carbide formed thereon. On SiC layer there is a planarizing layer of dielectric from light-transmitting polymer. Planarizing layer comprises an array of nanorods GaN pre-synthesized on a SiC layer and oriented perpendicular to the substrate; a light-transmissive electrode is formed on the planarizing layer, which provides electrical contact with the nanorods. Layers of the device are formed in stages. First, SiC is formed on a silicon substrate having a surface with crystallographic orientation (111) by substitution of atoms to form carbon-vacancy structures, then, mass of nanorods of GaN oriented perpendicular to substrate is formed on layer of silicon carbide by molecular-beam epitaxy with plasma activation of nitrogen, after which electrode is formed. Further, an array of nanorods of GaN is coated with a planarizing layer of a dielectric material from a solution of a light-transmitting polymer, and a light-transmissive electrode is formed on a planar layer at a fifth step.
EFFECT: invention provides high crystalline perfection of photosensitive structure due to matching parameters of crystal lattices of formed layers with simultaneous expansion of absorbed radiation range.
5 cl, 3 dwg
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Authors
Dates
2019-04-16—Published
2018-07-26—Filed