METHOD OF CONNECTING PLATE MATERIALS WITH METALS Russian patent published in 1994 - IPC

FIELD: electrical technology. SUBSTANCE: connective interlayer containing layer of aluminium or nickel foil is applied on the surface of ceramic material. Then packet of ceramic materials is assembled, brought into contact with metal having applied on it compensating interlayer. The process is followed by displacing on plate electrodes and by heating to temperature not more 900 C. Then applying voltage is carried out till corona discharge is struck. Above mentioned compensating interlayer has glass layer containing oxides of alkali, rare-earth metal aluminium applied on metal surface and layer of aluminium or nickel foil. EFFECT: improves hermetic nature of connection at normal temperatures decreases mechanical stress of connection, simplifies technology.