MICROASSEMBLY MANUFACTURING PROCESS Russian patent published in 1995 - IPC

FIELD: electronic engineering. SUBSTANCE: in order to protect components against chemically active agents, to carry out local analysis of defective components while maintaining them in working condition, functional semiconductor device is potted in compound having the following composition, mass percent: rholivsan 60-70; aromatic solvents 30-33, followed by curing at (20 ± 10) C for 2 h; for local analysis of defective components while maintaining their functioning ability, this compound is introduced while opening area required for procedure. EFFECT: facilitated procedure, improved protection against chemically active agents. 4 dwg, 1 tbl