SPACE MICROMODULE Russian patent published in 2022 - IPC H01L25/04 

FIELD: cosmonautics.

SUBSTANCE: invention relates to space microelectronic apparatus and can be used as part of the onboard and ground-based equipment of high-density installation space vehicles. Proposed is a micromodule including a body with a cover, a base, N alternating switching boards containing through metallised holes, switching metal layers in the form of microstrip lines, and dielectric layers, with unpackaged chips installed thereon, electrically connected to each thereof, with spaces between the boards filled with a compound. In the proposed micromodule, on the side not occupied by the switching layers, blind holes for the installation of unpackaged chips and through holes for switching the board with the unpackaged chips after the formation of the switching layers are located consecutively, wherein the depth of the blind holes is selected from the ratio H≤h+a, where H is the thickness of the unpackaged chips, mcm; h is the depth of a blind hole, mcm; a is the thickness of the adhesive after the unpackaged chip is installed and cured, mcm.

EFFECT: creation of a manufacturable space micromodule with reduced weight and size characteristics, intended for operation as part of the onboard equipment in a wide temperature range with a prolonged operating life.

8 cl, 4 dwg