FIELD: electronics. SUBSTANCE: invention refers to process of working of mounting surfaces of contact plates for active elements of semiconductor devices. It involves one operation of working of mounting surface, that is turning with cutter of natural diamond on precision machine. Turning modes: cutting rate 7.0-9.0 m/s, cutting depth 2.0-5.0 μm, feed 2.0-4.0 mm/min. Several plates can be turned simultaneously. EFFECT: increased quality and reliability of active elements, reduced cost of their manufacture and enhanced labour productivity.
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Authors
Dates
1995-12-20—Published
1993-03-10—Filed