FIELD: adhesion of various materials. SUBSTANCE: proposed composition contains (mass parts): oligodiene urethane epoxide 10-99, oligoether epoxide laproxide 1-80, hardener of amine or amide type 5-60, organic solvent 1-15. Proposed composition may additionally contain diethylene glycol urethane, alkyd epoxy resin and/or epoxy resin. Said composition is affected by hardening which is carried out with the help of ultrasound treatment. The process takes place at wavelength being similar or multiple to wavelength of heat oscillations of desired composition. EFFECT: improves quality of desired product. 2 tbl
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Authors
Dates
1996-06-10—Published
1992-04-07—Filed