FIELD: electronic devices. SUBSTANCE: both sides of circuit board have recesses where semiconductor chips without housings are located so that are positioned on same level as board surface. Thickness of binding is 1-30 mcm. Device design presumes level of its integration and strength due to optimal distance between recesses both in horizontal and vertical directions along and across hybrid integral circuit. EFFECT: improved weight and size characteristics, increased density for chip arrangement. 1 dwg
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