MULTIPLE-LAYER CHIP FOR MICROWAVE AND SHORT- WAVE RANGE Russian patent published in 1997 - IPC

Abstract RU 2088057 C1

FIELD: electronic devices. SUBSTANCE: device has several substrates with conductor structure. Substrates which are adjacent to ones that carry unpacked semiconductors have additional recesses. Unpacked semiconductors are mounted in recesses using specific procedure. EFFECT: increased functional capabilities. 3 cl, 2 dwg

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RU 2 088 057 C1

Authors

Iovdal'Skij V.A.

Budanov V.N.

Jashin A.A.

Kandlin V.V.

Dates

1997-08-20—Published

1992-07-27—Filed