METHOD TO MAKE HYBRID INTEGRAL CIRCUIT OF MICROWAVE BAND Russian patent published in 2014 - IPC H01L27/13 

FIELD: electricity.

SUBSTANCE: method for manufacturing of powerful hybrid integral circuit of microwave band includes manufacturing of a multilayer dielectric substrate, application of metal-sprayed coatings of the layout to each dielectric layer and earthing metal coating at the reverse side of the lower layer of the multilayer dielectric substrate, adjustment of via openings in dielectric layers, sintering and annealing, placement and fixture of the multilayer dielectric substrate by the earthing metal coating to electricity- and heat-conducting base, placement and fixture of an active heat-generating component in each via opening with placement of their faces in the same plane, electrical connection of bond areas of the active heat-generating component to the layout metal-sprayed coatings of the multilayer dielectric substrate. At that one part of some dielectric layers is made with via opening having cross-section proportioned to the active heat-generating component exceeding less than 0.5 mm, the other part is made with less cross-section at the ratio of their cross-sections ratio of 1.4-10 respectively, via openings in the latter are filled with the material of metal-sprayed coating, and while forming sequence of the multilayer dielectric substrate some dielectric layers with bigger cross-section are placed at its face while the other layers with less cross-section are placed at the reverse side.

EFFECT: improvement of manufacturability and electric performance.

3 cl, 1 dwg, 1 tbl