DRY LITHOGRAPHY PROCESS Russian patent published in 1997 - IPC

Abstract RU 2082257 C1

FIELD: microlithography. SUBSTANCE: process involves coating substrate with resist layer and forming concealed image in it by exposure. Resist layer is applied by dry plasma polymerization in two stages; first main resist layer is formed directly in plasma and then sensing layer, in plasma afterglow region. EFFECT: facilitated procedure. 8 cl, 3 dwg

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RU 2 082 257 C1

Authors

Simakov N.N.

Fedorov V.A.

Morozov O.V.

Filimonov S.I.

Bujanovskaja P.G.

Dates

1997-06-20—Published

1995-05-16—Filed