MULTICHIP MODULE Russian patent published in 1999 - IPC

FIELD: microelectronics; semiconductor integrated circuits. SUBSTANCE: multichip module has several semiconductor chips whose contact pads are arranges at same level; chip-to-chip space is filled with no- shrinkage structural bond not protruding beyond front surface that forms monolithic module with planar-mosaic structure, its thickness making up 1.0-1.5 of that of semiconductor chips; chip-to-chip switching members are arranged inside module in one or more planes parallel to front surface of semiconductor chips. EFFECT: improved strength and reliability of chip-to- chip switching; facilitated manufacture. 2 cl, 1 dwg