HERMETIC ASSEMBLY MODULE FOR INSTALLATION OF MICRO-RADIO ELECTRONIC EQUIPMENT MADE BY THE GROUP METHOD WITH THE SUBSEQUENT CUTTING INTO MODULES Russian patent published in 2019 - IPC H01L23/52 

FIELD: technological processes.

SUBSTANCE: using for surface mounting. Essence of the invention consists in the fact, that the hermetic assembly module for the installation of micro-radio electronic equipment, made by the group method with the subsequent cutting into modules, contains substrate and cover hermetically sealed by means of glass-ceramic solder, made of semiconductor or dielectric materials, in the substrate are made through hermetically sealed microholes, which are completely metallized by a conductive material and are placed between and under the blind cavities under the crystals, external leads of which are placed on the outer surface of the substrate and are provided with a layer of solder that allows the module to be mounted on the board; on the inner side of the substrate there are blind cavities with crystals placed in them, which are connected to the metallized microholes by the weldless method by applying a layer of a planarized dielectric to the contact area and forming a metallization between the contact pads of the crystals and the metallized microholes, crystals in the joints with metallized microholes, placed under the crystals, are fixed with the help of conductive material.

EFFECT: providing opportunities to increase reliability, tightness, reduce thermal resistance between the crystal and the substrate, reduce weight and size characteristics, improve the manufacturability and installation of the specified module through the use of group manufacturing method thereof.

3 cl, 2 dwg