MULTI-CHIP MODULE Russian patent published in 2008 - IPC H01L25/04 

FIELD: electrical engineering.

SUBSTANCE: invention relates to a multi-chip module representing a chip holders pack wherein the IC is fitted onto the cladded microboard and connected to the outputs by conductors and the board cladding microconductors. The chip holder represents three cladded high heat-transfer microboards arranged one onto the other. The lower microboard is solid, the medium and upper boards represent the frames with central rectangular holes. The lower medium and upper boards form a blind stepped space with a bulge accommodating a pad connected to the IC fitted onto the lower microboard. The outer outputs are made up of the channels formed by coaxial through holes arranged along the edges of the lower medium and upper microboards and sealed by solder.

EFFECT: efficient sealing and high radiation strength under mechanical and environmental effects.

5 cl, 3 dwg