FIELD: semiconductor engineering; nondestructive inspection of semiconductor materials. SUBSTANCE: this nondestructive microwave measurement method involves formation of nondestructive contacts for structure: liquid one, transparent for microwave radiation on half-insulating substrate side and hold-down contact on conducting layer side. Applied to n-i film-to-half-insulating structure transition through these contacts is DC reverse bias voltage Vsub which changes width of n-i transition packing area and thickness of n-i transition is modulated by applying through these contacts ac bias voltage V
Authors
Dates
1997-11-27—Published
1995-03-10—Filed