FIELD: power semiconductor engineering. SUBSTANCE: process includes cutting of silicon ingot into plates and formation of diffusion structure with p-n junctions. Cathode emitter junction for thyristor with broad n-type base region or anode emitter junction for thyristors with broad p-type base region is formed on side opposite to that cut off. EFFECT: facilitated procedure. 1 tbl
Title | Year | Author | Number |
---|---|---|---|
SEMICONDUCTOR POWER DEVICE | 2006 |
|
RU2321102C1 |
SEMICONDUCTOR DEVICE WITH SELF-PROTECTION FROM DISRUPTION DURING PERIOD OF RESTORATION OF LOCKING PROPERTIES | 2005 |
|
RU2297075C1 |
METHOD OF CONTROL OVER VOLTAGE IN OPEN STATE OF THYRISTORS AND DIODES | 1996 |
|
RU2119211C1 |
SILICON SOLAR CELL MANUFACTURING PROCESS | 1993 |
|
RU2114491C1 |
METHOD FOR DECREASING THYRISTOR LOCKING TIME | 1998 |
|
RU2152107C1 |
BIPOLAR TRANSISTOR MANUFACTURING PROCESS | 1995 |
|
RU2110868C1 |
PROCESS OF MANUFACTURE OF BICOS/BIMOS DEVICE | 1998 |
|
RU2141148C1 |
PROCESS OF MANUFACTURE OF BIPOLAR TRANSISTOR | 1995 |
|
RU2099814C1 |
REVERSE-CONDUCTING POWER THYRISTOR | 1994 |
|
RU2082259C1 |
THYRISTOR QUALITY CONTROL DEVICE | 1995 |
|
RU2112989C1 |
Authors
Dates
1998-02-27—Published
1996-07-23—Filed