FIELD: electronics.
SUBSTANCE: invention relates to radio electronics and can be used in production of printed circuit boards, used in radio-electronic equipment designing. Achieved by using unpackaged hardware components mounting into substrate body by creating on substrate of rectangular holes, corresponding to IC crystals permissible increase, mounted in these holes. Topological relations layout between chips is performed by vacuum deposition, when on substrate with crystals through mask forming current-conducting paths from copper and nickel, protective layer, wherein, without using soldering and welding, forming connection of IC contact pads with board current-conductive paths.
EFFECT: technical result is increasing of degree of IC chips integration and reduced weight and size.
1 cl, 7 dwg
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