MULTICHIP MODULE Russian patent published in 2019 - IPC H01L25/04 

FIELD: electrical engineering.

SUBSTANCE: multi-level multichip module includes at least two circuit boards and two switching boards which are equal in planar dimensions, which together with electronic components form a module level. Levels of the module are interconnected mechanically and electrically by means of switching frames of the same planar dimensions as switching boards. Number of frames for interconnection of module levels is selected sufficient for placement in formed inner cavity of electronic components. Connection of each new level to number of already existing in module reproduces configuration of interface of docking, therefore module has open architecture and allows to increase levels in it. In order to ensure unification of the switching board, the electronic components are mounted on it through a circuit board with the original topology of the horizontal electrical wiring. In order to provide possibility of wireless commutation of circuit board with switching board, in the latter there is a through-window which is slightly smaller than circuit board. Circuit board is installed on the switching board so that the electronics components are in the switching board window, and the corresponding circuits of the contact pads of the mounting and switching boards coincide. In such situation, horizontal electric wiring of the switching board consists only in switching of contact pads of its external and internal circuits, i.e. it ceases to be original and suitable for use in modules with another set of electronic components.

EFFECT: invention can be used in production of multilevel multichip modules in three-dimensional assembly with improved operational characteristics.

3 cl, 10 dwg