FIELD: optical instrument making. SUBSTANCE: method includes rotation of object with surface to be analyzed about first axis of rotation, formation of light spot on analyzed surface and separate perception of mirror-image of light scattered by analyzed surface at point of light spot fall. Obtained signals are analyzed, and surface defects are determined. Analyzer intended for this method realization moves light spot positioned beyond limits of analyzed surface relative to rotated analyzed surface over arc about second axis of rotation. It detects defects on surface of plates by measuring the scattered light value. Use of method for control of semiconductor plates makes it possible to build measuring instrument into production equipment of electronic industry due to reduction of its sizes and cost. EFFECT: enhanced control. 16 cl, 3 dwg
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