FIELD: protection of substrates, more particularly metallic pipes. SUBSTANCE: described is solidifying polymeric composition which is liquid at 20 C comprising epoxy resin or mixture of epoxy resins, solidifying agent and inert inorganic filler. Solidifying agent is first component, e.g. cycloaliphatic or aromatic amine and second compound, e.g. polyamide amine. Ratios of components are as follows, wt %: epoxy resin or mixture of epoxy resins, 25-60; solidifying agent, 5-25; inert inorganic filler, 20-65. Also described are method of applying coatings and protective coating of substrate. EFFECT: improved characteristics of the composition. 8 cl, 2 dwg, 14 ex, 4 tbl
Authors
Dates
2000-03-10—Published
1995-03-08—Filed