PROCESS OF MANUFACTURE OF PRINTED CIRCUIT BOARD Russian patent published in 2000 - IPC

Abstract RU 2149525 C1

FIELD: electrical and radio engineering. SUBSTANCE: process s of manufacture of printed circuit board id realized as follows: Interconnection of printed circuit board is prepared with the aid of computer. Current-conducting particles are deposited on flexible dielectric substrate by means of jet printer forming current-conducting pattern. Substrate with current-conducting pattern is bonded to board. EFFECT: simplified technology and reduced manufacturing time. 8 cl, 1 dwg

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RU 2 149 525 C1

Authors

Rakov D.L.

Dates

2000-05-20—Published

1999-02-10—Filed