FIELD: electrical and radio engineering; printed-circuit board manufacture.
SUBSTANCE: proposed process includes following procedures. Computer-designed printed-circuit board wiring layout prepared primarily with aid of laser printer is applied in mirror image to glazed paper. The latter is aligned with board and pattern formed by printer powder is disposed directly on copper foil board. Blank obtained in the process is heated to temperature exceeding powder melting point.
EFFECT: facilitated procedure, reduced time for manufacturing printed-circuit boards.
1 cl, 1 dwg
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