PROCEDURE OF TEST OF METAL SPECIMEN TO DETERMINE INCIPIENT CRACK AND ITS GROWTH IN CONTACT WITH LIQUID SOLDER Russian patent published in 2000 - IPC

Abstract RU 2150099 C1

FIELD: mechanical tests of metal specimens contacting liquid solder. SUBSTANCE: procedure of test of metal specimen to determine incipient crack and its growth under effect of tensile stress consists in making of incision of preset depth in surface of specimen. Layer of solder is deposited in zone of incision and specimen is placed into furnace for test. Specimen is heated to temperature of soldering with simultaneous action of preset tensile stress on it. Specimen is held at this temperature at stages of incipient crack and its growth during which crack initiates and grows. After each holding specimen is cooled under load and incipient crack and its growth are recorded on photograph. EFFECT: possibility of determination of stresses under which process of initiation of crack starts. 3 cl, 1 dwg

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RU 2 150 099 C1

Authors

Semenov V.N.

Dates

2000-05-27Published

1998-11-20Filed