METHOD FOR SURFACING COPPER OR COPPER ALLOYS ON SUBSTRATE OF HIGH-ALLOY NICKEL ALLOYS Russian patent published in 2005 - IPC

Abstract RU 2252117 C2

FIELD: power production machine engineering, possibly manufacture of such parts whose surface layer operate in condition of erosion-corrosion actions, high mechanical loads, influence of cryogenic temperatures, for example in power production or chemical-production plants.

SUBSTANCE: method comprises steps of placing copper plate on substrate and melting it by means of electric-arc welding with use of non-consumable electrode; before placing plates, applying flux layers onto mutually joined surfaces; insulating ( for preventing contact with arc plasma) end edges of copper plate and portions of substrate near edges of plate along the whole perimeter; realizing surfacing at melting temperature of copper plate that causes no fusion of base metal of substrate.

EFFECT: enhanced quality of surfacing.

6 cl, 3 dwg, 1 ex

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RU 2 252 117 C2

Authors

Loginov A.L.

Grigorkin N.M.

Tumanov L.A.

Nikonov V.P.

Movchan Ju.V.

Shashelova G.V.

Dates

2005-05-20Published

2003-03-31Filed