THERMOELECTRIC MODULE MANUFACTURING PROCESS Russian patent published in 2000 - IPC

FIELD: thermoelectric engineering. SUBSTANCE: manufacturing process includes connection of first current-conducting board to first substrate for its fixation in position, installation of set of p- and n-bars on first contacts so that n-bars are alternating with p-bars and that they are spaced apart along direction of pile spreading, connection of one edge of each bar to first contacts, cutting of each bar into chips at the same time cutting horizontal jumpers to distribute chips among first individual contacts, arrangement of set of second contacts of second substrate on chips to obtain electric circuit of series-connected chips in combination with first contacts. Novelty is that horizontal jumpers physically coupled with first contacts are cut along with cutting thermoelectric bars after first contacts are installed on first substrate. Easy high-precision cutting of bars into respective chips is conditioned by the fact that bars on first contacts can be reliably held in position together with first contacts by means of first substrate. In addition, as chips produced in this way can be held together with first contacts by means of first substrates, they can be held in desired position during next procedure of module assembly. EFFECT: facilitated assembly of module. 37 cl, 52 dwg