THERMOELECTRIC MODULE AND ITS MANUFACTURING PROCESS Russian patent published in 2001 - IPC

Abstract RU 2173493 C2

FIELD: thermoelectric modules for heat-transfer systems. SUBSTANCE: thermoelectric module whose matrix is composed of series-connected thermoelectric chips has first board incorporating at least two matrix internal jumpers which are responsible for electrical connection between adjacent matrices of chips. Two adjacent matrices of second contacts connected through second jumpers form second separate discrete members insulated from each other on other side of mentioned first contacts. EFFECT: provision for temperature stress relaxation. 18 cl, 48 dwg

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RU 2 173 493 C2

Authors

Tsuzaki Mishimaza

Maekava Nobuteru

Ivamoto Narimaza

Imai Dzhandzhi

Okada Khiroaki

Komatsu Teruaki

Mjuraze Shinia

Inue Niroiuki

Sagava Mizaiuki

Sakai Iuri

Dates

2001-09-10Published

1998-11-24Filed