FIELD: thermoelectric modules for heat-transfer systems. SUBSTANCE: thermoelectric module whose matrix is composed of series-connected thermoelectric chips has first board incorporating at least two matrix internal jumpers which are responsible for electrical connection between adjacent matrices of chips. Two adjacent matrices of second contacts connected through second jumpers form second separate discrete members insulated from each other on other side of mentioned first contacts. EFFECT: provision for temperature stress relaxation. 18 cl, 48 dwg
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Authors
Dates
2001-09-10—Published
1998-11-24—Filed