FIELD: electronic engineering. SUBSTANCE: laminated-structure molded plate made of cleaving thermoelectric material has rather parallel cleaving planes. Almost all cleaving planes are inclined through certain angle from upper and lower faces of flat ingot. Molded plate may be cut into several plates along cutting planes perpendicular to cleaving planes causing no essential interlayer damage. Opposite sides of plate formed by cutting planes carry electrodes. Plate is cut into separate chips; one of electrodes is secured to substrate. Since plate is cut along planes perpendicular to its cleaving planes, it can be cut into chips without noticeable damage. Molded plate is manufactured by means of mold that has cavity and elongated slit running though mentioned cavity to distant end of slit inside mold. Crystallization starts upon filling cavity and slit with molten material from distant end of slit and goes on along the latter and then along cavity practically in same direction. EFFECT: provision for producing laminated structure of flat ingot. 13 cl, 21 dwg
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Authors
Dates
2000-12-10—Published
1998-01-08—Filed