METHOD TESTING THICKNESS OF FILM IN PROCESS OF ITS DEPOSITION AND DEVICE FOR ITS REALIZATION Russian patent published in 2000 - IPC

FIELD: instrumentation. SUBSTANCE: invention is designed for nondestructive test of thickness and variations in thickness of films specifically in gears for deposition of photoresist in photolithography. Salient feature of invention consists in fall of radiation beam with wave length λ_st on to tested surface an angle of θ and in recording of intensity of radiation reflected from substrate in process of film deposition. Changes of intensity of reflected radiation are recorded after termination of process of film deposition with simultaneous rotation of substrate and longitudinal movement of optical unit. In this case wave length λ of radiation is chosen from condition λ = λ_stK/(K- 1/4), where K=1, 2,...is coefficient and change of thickness of film is determined in correspondence with mathematical expression. Device testing thickness of film in process of its deposition has radiation source, rotary mirrors and radiation detector installed in one optical unit mounted for longitudinal movement relative to substrate. Substrate holder is fitted with rotation mechanism. EFFECT: measurement of thickness of film deposited over entire area of substrate. 2 cl, 2 dwg