FIELD: doped silicon production. SUBSTANCE: according to invention, radiation treatment is conducted in high-flux pulse reactor and not in continuous-action one; procedure is started when fluency approaches 1017 cm-2 and pulse length at mid-height ranges between one hundredth of second and hundredth fractions of characteristic time of interstitial atom exit to specimen surface; post-radiation annealing is effected under light conditions or is not made at all. EFFECT: reduced concentration of post-radiation flaws. 1 dwg
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Authors
Dates
2001-01-20—Published
1999-09-06—Filed