FIELD: plasma engineering, in particular, devices with an indirect heating by arc discharge, applicable as a source of linear thermal radiation at a dynamic plasma treatment of surfaces of non-metallic materials, in particular, electronic integrated circuits. SUBSTANCE: the device uses a water-cooled anode and cathode pressed in whose end piece is an insert of refractory metal, body, nozzle, magnetic control winding, oscillator, regulated DC source, as well as water and gas lines; in the initial section the electrodes are diverging ones, and in the working area - parallel ones, an insert of refractory metal is pressed in the end piece of each electrode in its length, each electrode is enveloped by a clamp, and the plates of the magnetic core coupled to the magnetic control winding, and the holders with blanks are positioned in planes that are parallel to the plane of the electrodes. Besides, an arc chute with a grate of metal plates is positioned between the working area and the nozzle. Relative position of the electrodes and the magnetic control coil makes it possible to treat the surface of a non-metallic article by means of a source of linear thermal radiation, in the given case it is an arc moving in a transverse magnetic field, which provides for a uniform heating of the surface of the article being treated. To provide a uniform movement of the arc, use is made of the magnetic control winding, as well as the clamps of their magnetic material enveloping the electrodes in the working area in their section. Reduction of arc contraction is ensured due to the presence of an insert of refractory metal with an electron output potential lower than that of the electrode base material in the end piece of each electrode in its length, as well as due to the shape of the electrode end piece. Provision of the arc chute facilitates are extinction after it passes the working area, which reduces the thermal load on the device components. EFFECT: uniform heating of the surface of article being treated. 2 cl, 2 dwg
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Authors
Dates
2001-02-20—Published
1999-06-15—Filed