FIELD: mechanical engineering; instrument making. SUBSTANCE: device may be used for final machining of workpieces by grinding. Device has a base and upper plate positioned in parallel with it. Upper plate carries workpiece attachment facility. Thermal element body is fixed to the base and to upper plate. Workpiece microfeed is performed by means of one thermal element with voltage supplied to the latter. EFFECT: improved quality of machining. 1 dwg
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