METHOD MEASURING HEAT RESISTANCE OF JUNCTION-PACKAGE OF DIGITAL INTEGRATED MICROCIRCUITS Russian patent published in 2001 - IPC

FIELD: equipment measuring thermal parameters of semiconductor devices and integrated microcircuits. SUBSTANCE: method can be employed to test quality of manufacture of digital integrated microcircuits and to evaluate their temperature resources.. According to method supply voltage is fed to supply bus of tested integrated microcircuit, switching pulses are sent to inputs of one or more logic elements of microcircuit. One of non-switched logic elements is set in advance to specified logic state. Electric temperature- sensitive parameters of this logic element are measured. Results of measurement are used to determine heat resistance of junction-package of integrated microcircuit. Repetition frequency of switching pulses is changed in agreement with linear law to reduce measurement time and after time of delay exceeding three thermal time constants of junction- package of microcircuit after start of change of repetition frequency of switching pulses rate of change of temperature- sensitive parameters is measured and used to determine heat resistance of junction-package of integrated microcircuit. EFFECT: reduced time of measurement of heat resistance of junction-package of digital integrated microcircuit. 1 dwg