FIELD: instrumentation.
SUBSTANCE: method comprises supply of voltage to the tested chip, switching of a logical state of a heating logical element by sequence of periodic impulses, measurement of change of the temperature sensitive parameter, determination of heat resistance, note that the heating logical element is switched by highly sensitive impulses, and the temperature sensitive parameter is the period of sequence of the low-frequency impulses generated by the multivibrator, and the multivibrator consists of a logical element of the tested chip and the logical element of the reference chip operated together with passive elements of the multivibrator at constant temperature.
EFFECT: possibility of shortening time of measurement and error of measurement of temperature sensitive parameter.
2 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| METHOD FOR DETERMINATION OF HEAT-TRANSFER RESISTANCE FOR DIGITAL INTEGRATED CIRCUITS | 2011 |
|
RU2490657C2 |
| METHOD OF DETERMINING THERMAL RESISTANCE OF DIGITAL INTEGRAL MICROCIRCUITS | 2020 |
|
RU2744716C1 |
| METHOD TO DETERMINE HEAT JUNCTION-TO-CASE RESISTANCE OF DIGITAL INTEGRATED MICROCIRCUITS | 2014 |
|
RU2569922C1 |
| METHOD FOR DETERMINATION OF HEAT-TRANSFER RESISTANCE FOR DIGITAL CMOS INTEGRATED CIRCUITS | 2012 |
|
RU2504793C1 |
| METHOD FOR MEASURING THE TRANSIENT RESPONSE OF DIGITAL INTEGRATED MICROCHIPS | 2020 |
|
RU2766066C1 |
| METHOD FOR DETERMINING THERMAL IMPEDANCE OF CMOS DIGITAL INTEGRATED MICROCIRCUITS | 2011 |
|
RU2463618C1 |
| METHOD OF DIGITAL INTEGRATED CIRCUITS TRANSIENT THERMAL CHARACTERISTICS MEASURING | 2015 |
|
RU2613481C1 |
| METHOD OF DETERMINING THERMAL IMPEDANCE OF VERY LARGE SCALE INTEGRATED CIRCUITS - MICROPROCESSORS AND MICROCONTROLLERS | 2012 |
|
RU2521789C2 |
| METHOD FOR MEASURING TRANSIENT THERMAL CHARACTERISTICS OF DIGITAL INTEGRATED CIRCUITS | 2017 |
|
RU2697028C2 |
| METHOD FOR MEASURING THERMAL IMPEDANCE OF DIGITAL INTEGRATED CIRCUITS | 2016 |
|
RU2649083C1 |
