METHOD FOR MEASURING THE TRANSIENT RESPONSE OF DIGITAL INTEGRATED MICROCHIPS Russian patent published in 2022 - IPC G01R31/28 

FIELD: measuring.

SUBSTANCE: invention relates to the technology for measuring the thermal characteristics and thermal parameters of digital integrated microchips (DIMC) and can be used for monitoring the quality of DIMC of a small and medium degree of integration in the output or output monitoring. Substance: supply voltage E_sup is supplied to the monitored microchip, the chip is heated by supplying high-frequency switching pulses to the inputs of the logic elements thereof, the instantaneous consumed power and a temperature-sensitive parameter with a known temperature coefficient K_U are measured in the process of heating the microchip at preset time points. Prior to supplying the high-frequency switching pulses, all logic elements of the monitored microchip are set to the state of the logical unit at the output and the sum U₁(0) of voltages of the logical unit at the output of all logic elements and the consumption current I_cons(t₀) before heating are measured within a short time interval τ_meas. High-frequency switching pulses are then applied to the inputs of all logic elements. At preset times t_k, the supply of high-frequency switching pulses is terminated, all logic elements of the monitored chip are set to the state of the logical unit at the output for a short time interval τ_meas. Within the time τ_meas, the sum of voltages U₁(t_k) of the logical unit at the output of all logic elements and the consumption current I_cons (t_k) of the microchip are measured. The value of the transient heat response at the preset time point is determined by the formula wherein is the average consumption current of the microchip from the time t₀ to the time t_k.

EFFECT: developed method for measuring the transient response of DIMC.

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