FIELD: chip-card that is card incorporating integrated-circuit chip. SUBSTANCE: adhesive joint between integrated-circuit chip with semiconductor chip carrying member 1 and plastic card member has multilayer structure of flexible medullar acrylic layer 4 and two extreme hot-adhesive layers 2 adjacent to surfaces being joined. Intermediate layer 3 is provided between each extreme layer 2 and medullar layer 4. EFFECT: enhanced life of adhesive joint. 6 cl, 3 dwg _
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|---|---|---|---|
| INTEGRATED CIRCUIT MODULE | 1996 |
|
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|
RU2191446C2 |
| INTEGRAL CIRCUIT ASSEMBLY | 1996 |
|
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|
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|
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| INTEGRATED-CIRCUIT CARD MODULE | 1997 |
|
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| CARRYING MEMBER FOR SEMICONDUCTOR CHIP DESIGNED FOR BUILDING INTO INTEGRATED-CIRCUIT CARD | 1998 |
|
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| CARD HAVING BUILT-IN IC-CHIP AND SEMICONDUCTOR IC-CHIP USABLE WITH THE CARD | 1997 |
|
RU2190879C2 |
