FIELD: production of semiconductor instruments for power electronics, namely connection of wire leads. SUBSTANCE: tool includes lengthwise groove in the form of equilateral trapezium with dimension of lower base equal to 1.0 d, dimension of upper base equal to 0.75 d and height equal to 0.6 d, where d - diameter of welded wire. Rounding radius of front edge of working section of tool is equal to wire bending radius in zone of its contact with body at making bridge between body and chip. Rounding radius of its back edge is equal to bending radius of wire fed through capillary opening to welding zone. EFFECT: improved design of tool, enhanced quality of microwelded joints of wire leads. 5 dwg
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Authors
Dates
2002-02-10—Published
1999-12-15—Filed