FIELD: flux-free soldering of semiconductor devices by lead base solders. SUBSTANCE: method used for assembling silicon chips in cases of semiconductor devices by flux-free soldering includes covering collector side of chip by nickel layer and soldering. Nickel layer on collector side of chip is covered with electrolytic coat of nickel-tin alloy with 30-50% of nickel and chloro-fluoride electrolyte with organic dope OC-20; PSr2.5 solder foil is placed between chip and nickel-plated case; soldering is made in the environment of hydrogen or in vacuum. EFFECT: facilitated procedure, improved wetting and spreading ability of solder, enhanced temperature and corrosion resistance of soldered joints.
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